Top products
Recently Viewed
No data.
Filters
CollapseExpand封装/外壳 :
4-DIP(0.300",7.62mm)6-LSOP(0.063",1.60mm 宽)6-TSOP(0.065",1.65mm 宽)8-SOIC(0.154",3.90mm 宽)PowerPAK® SC-70-6 双SC-100,SOT-669,4-LFPAKTO-220-3TO-220-3 全封装,隔离接片TO-251-3 短引线,IPak,TO-251AATO-252-3,DPak(2 引线+接片),SC-63TO-261-4,TO-261AA
Close供应商器件封装 :
4-DIP,Hexdip,HVMDIP6-TSOP8-SOIC NCPT3D-PakLFPAK,Power-SO8Micro6™(TSOP-6)SOT-223SOT-223-3TO-220ABTO-251AATO-252,(D-Pak)
Close不同 Id、Vgs 时的 Rds On(最大值) :
1.8 欧姆 @ 2A,10V10.6 毫欧 @ 10A,10V100 毫欧 @ 3.2A,10V158 毫欧 @ 2.7A,10V160 毫欧 @ 1.9A,10V180 毫欧 @ 1.6A,10V200 毫欧 @ 1.6A,10V200 毫欧 @ 1A,10V200 毫欧 @ 4.6A,10V200 毫欧 @ 4.8A,10V200 毫欧 @ 6A,10V399 毫欧 @ 3.8A,10V4.4 欧姆 @ 1A,10V500 毫欧 @ 580mA,10V61 毫欧 @ 3.3A,10V
Close