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收起展开制造商 :
Rohm SemiconductorSharp MicroelectronicsDiodes IncAnalog Devices (AD)ToshibaFairchild 仙童Texas Instruments德州STMicroelectronics意法半导体ON SemiconductorRichtek USA Inc
关闭工作温度 :
-25°C ~ 105°C-25°C ~ 125°C-25°C ~ 85°C-30°C ~ 85°C-40°C ~ 105°C-40°C ~ 125°C-40°C ~ 150°C-40°C ~ 85°C-55°C ~ 100°C-55°C ~ 125°C-55°C ~ 150°C0°C ~ 125°C0°C ~ 70°C
关闭封装/外壳 :
10-VFDFN 裸露焊盘20-TSSOP(0.173",4.40mm 宽)20-TSSOP(0.173",4.40mm 宽)裸露焊盘6-TSSOP(5 引线),SC-88A,SOT-3536-WDFN 裸露焊盘6-WFDFN 裸露焊盘8-DIP(0.300",7.62mm)8-SOIC(0.154",3.90mm Width)裸露焊盘8-SOIC(0.154",3.90mm 宽)8-SOIC(0.173",4.40mm 宽)8-TSSOP,8-MSOP(0.118",3.00mm 宽)8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘8-VDFN 裸露焊盘8-WFDFN 裸露焊盘SC-74A,SOT-753SC-82SOT-23-6TO-220-3TO-220-3 全封装截切引线TO-220-3 整包TO-236-3,SC-59,SOT-23-3TO-243AATO-252-3,DPak(2 引线+接片),SC-63TO-252-5,DPak(4 引线 + 接片),TO-252ADTO-261-4,TO-261AATO-263-4,D²Pak(3 引线+接片),TO-263AATO-263-6,D²Pak(5 引线+接片),TO-263BA
关闭供应商器件封装 :
20-TSSOP6-SON(2x2)6-WDFN(2x2)8-MSOP8-MSOP-EP8-PDIP8-SOIC8-SOIC N8-SOIC-EP8-SON 裸露焊盘(3x3)8-SOPD-PakDDPAK/TO-263-3PW-MOLDSC-70-5SOT-223SOT-23-3SOT-23-5SOT-89SOT-89-3TO-220FPTO-252-3TO-252-5TO-252,(D-Pak)
关闭电压 - 输入 :
0.8 V ~ 5.5 V1.5 V ~ 5.5 V2.2 V ~ 5.5 V2.3 V ~ 5.5 V2.4 V ~ 5.5 V2.5 V ~ 10 V2.5 V ~ 16 V2.5 V ~ 5.5 V2.7 V ~ 10 V2.7 V ~ 5.5 V2.7 V ~ 6.5 V3 V ~ 12 V3 V ~ 16 V3 V ~ 5.5 V4.5 V ~ 14 V4.5 V ~ 36 V4.5 V ~ 5.5 V4.5 V ~ 8 V8 V ~ 25 V最高 20V最高 5.5V
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