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收起展开制造商 :
AtmelNXP SemiconductorsAnalog Devices (AD)Texas Instruments德州STMicroelectronics意法半导体ON SemiconductorMaxim 美信IDT, Integrated Device Technology Inc
关闭工作温度 :
-20°C ~ 125°C-35°C ~ 85°C-40°C ~ 120°C-40°C ~ 125°C-40°C ~ 85°C-55°C ~ 100°C-55°C ~ 125°C-55°C ~ 150°C0°C ~ 120°C0°C ~ 125°C0°C ~ 85°C
关闭封装/外壳 :
10-TFSOP,10-MSOP(0.118",3.00mm 宽)14-SOIC(0.154",3.90mm 宽)16-LSSOP(0.154",3.90mm 宽)16-SOIC(0.154",3.90mm 宽)16-SSOP(0.154",3.90mm 宽)16-TSSOP(0.173",4.40mm 宽)20-TSSOP(0.173",4.40mm 宽)24-SSOP(0.154",3.90mm 宽)24-TSSOP(0.173",4.40mm 宽)8-SOIC(0.154",3.90mm Width)裸露焊盘8-SOIC(0.154",3.90mm 宽)8-TSSOP,8-MSOP(0.118",3.00mm 宽)8-WFDFN 裸露焊盘TO-226-3、TO-92-3 标准主体
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